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Specs
BatteryBatterySi/C Li-Ion 4800 mAh
Body BuildBody BuildAluminum frame
Body DimensionsBody DimensionsUnfolded: 167.3 x 75.6 x 7.2 mm | Folded: 86.5 x 75.6 x 14.9 mm
Body WeightBody Weight193 g (6.81 oz)
Camera FrontCamera FrontSingle: 50 MP, f/2.0, (wide), AF
Camera RearCamera RearDual: 50 MP, f/1.9, 23mm (wide), 1/1.56", 1.0µm, PDAF, OIS | 12 MP, f/2.2, 112˚ (ultrawide), AF
Charging WiredCharging Wired66W wired, 45% in 15 min | 5W reverse wired
Connectivity NetworkConnectivity NetworkGSM / CDMA / HSPA / CDMA2000 / LTE / 5G
Connectivity USBConnectivity USBUSB Type-C 2.0, OTG
Connectivity WirelessConnectivity WirelessWi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct | 5.3, A2DP, LE, aptX HD | GPS, GALILEO, GLONASS, QZSS, BDS (B1I+B1c) | Yes
Display ResolutionDisplay Resolution1080 x 2520 pixels, 21:9 ratio (~403 ppi density)
Display SizeDisplay Size6.8 inches, 108.0 cm | 2 | (~85.4% screen-to-body ratio)
Display TypeDisplay TypeFoldable LTPO OLED, 1B colors, 120Hz, HDR, Dolby Vision, BT.2020, 3000 nits (peak)
Identity BrandIdentity BrandHonor
Identity ModelIdentity ModelHonor Magic V Flip
Launch AnnouncedLaunch Announced2024, June 13
Launch StatusLaunch StatusAvailable. Released 2024, June 19
Memory InternalMemory Internal256GB 12GB RAM, 512GB 12GB RAM, 1TB 12GB RAM, 1TB 16GB RAM
Network 2G bandsNetwork 2G bandsGSM 850 / 900 / 1800 / 1900
Network 3G bandsNetwork 3G bandsHSDPA 800 / 850 / 900 / 1700(AWS) / 1900 / 2100
Network 4G bandsNetwork 4G bandsLTE
Network SpeedNetwork SpeedHSPA, LTE, 5G
Network TechnologyNetwork TechnologyGSM / CDMA / HSPA / CDMA2000 / LTE / 5G
Platform ChipsetPlatform ChipsetQualcomm SM8475 Snapdragon 8+ Gen 1 (4 nm)
Platform OSPlatform OSAndroid 14, MagicOS 8
SIM SIMSIM SIMNano-SIM + Nano-SIM